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A World Class Engineering School in the Heart of the Nation's Capital

GW to Advance Next Generation Chip Technologies as Part of $32.7M Center
January 6, 2023
Volker Sorger will lead one of four themes within the new center focused on ultra-dense heterogeneous interconnect and assembly.

Penn State leads semiconductor packaging, heterogeneous integration center
January 6, 2023
This new center is focused on improving the performance, efficiency, and capabilities of electronic systems for emerging commercial and defense applications.
