UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
Penn State leads semiconductor packaging, heterogeneous integration center
January 6, 2023
