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Dr. Korman Steps Into New Role at IEEE

January 12, 2023

Congrats to Prof. Can Korman on being selected as Associate Editor for the Institute of Electrical and Electronics Engineers’ Transactions on Magnetics Journal!

GW to Advance Next Generation Chip Technologies as Part of $32.7M Center

January 6, 2023

Volker Sorger will lead one of four themes within the new center focused on ultra-dense heterogeneous interconnect and assembly.

Penn State leads semiconductor packaging, heterogeneous integration center

January 6, 2023

This new center is focused on improving the performance, efficiency, and capabilities of electronic systems for emerging commercial and defense applications.

 

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